- ceramic packaging
- obudowa ceramiczna
English-Polish dictionary of Electronics and Computer Science. 2013.
English-Polish dictionary of Electronics and Computer Science. 2013.
Packaging and labelling — Packaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of design, evaluation, and production of packages. Package labelling (BrE) or labeling … Wikipedia
Ceramic engineering — Simulation of the outside of the Space Shuttle as it heats up to over 1,500 °C (2,730 °F) during re entry into the Earth s atmosphere Ceramic engineering is the science and technology of creating objects from inorganic, non metallic… … Wikipedia
Ceramic pin grid array — 133 MHz Pentium chip in a ceramic package You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
Electronic packaging — is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the product itself, and not to shipping containers. It applies both to end… … Wikipedia
Low temperature co-fired ceramic — (LTCC) is a well established multi layer technology which has been in use for many years in the microelectronics packaging industry. Each of the layers are processed in parallel and only brought together in an accurately aligned stack immediately … Wikipedia
Uma Chowdhry — was born in Mumbai, India in 1947. She received a Bachelors Degree in physics from Indian Institute of Science, Mumbai University in 1968 before coming to the United States. She received a Masters Degree in Science from Caltech in engineering… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
Timothy C. May — Timothy C. May, better known as Tim May was an engineer and chief scientist at Intel at an early and crucial point in that company s history. He is retired as of 2003.Discovery of Alpha Particle effects on Computer chipsAs an engineer, he is most … Wikipedia
DECstation — The model identification medallion of a DECstation 5000 Model 120 … Wikipedia
Business and Industry Review — ▪ 1999 Introduction Overview Annual Average Rates of Growth of Manufacturing Output, 1980 97, Table Pattern of Output, 1994 97, Table Index Numbers of Production, Employment, and Productivity in Manufacturing Industries, Table (For Annual… … Universalium